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主要硬件参数:
n) s$ s1 ]8 d8 n% o2 S0 QZynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade)
; i# {1 K) [- f3 S7 p4 GB 64-bit wide DDR4 memory
6 @/ H4 ~/ y* }& V* UIntegrated non-volatile memory devices
9 Q- c1 {6 N( F6 |/ ^9 MTPM2.0 security module( E [) N3 z, }6 W
Two 240-pin connectors with access to user-configurable I/O:
M9 p0 _: u! J) l4 w* K3 X4 X- vIntegrated and flexible power design( V" @/ m2 r8 @; \4 G' Z. B# p( w1 q
Compact mechanical size with integrated thermal heat spreader |
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