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主要硬件参数:% w; N7 A0 Y- k
Zynq UltraScale+ MPSoC (XCK26 in commercial (C) grade or industrial (I) grade)
: g9 Y4 a4 X- M& ^6 W* Q4 GB 64-bit wide DDR4 memory
7 {" m% \5 d/ U$ G, z# UIntegrated non-volatile memory devices
6 y- S R8 `- M! e# g' aTPM2.0 security module0 d3 M* e( F* q% M
Two 240-pin connectors with access to user-configurable I/O:
" x; K/ c4 N7 a* t7 S8 l; QIntegrated and flexible power design
: D7 ]3 a; Y6 w3 I( m s( j* T$ C' I) kCompact mechanical size with integrated thermal heat spreader |
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