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PCB中英对照二、 基材:
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1、 基材:base material
& r" l6 w* R# [ B$ L/ k+ E2、 层压板:laminate
. K- ~9 _3 @- }* ]! K3、 覆金属箔基材:metal-clad bade material & U8 P3 [: K- V
4、 覆铜箔层压板:copper-clad laminate (CCL)
# x8 t( n1 P7 |* D; [! A/ f5、 单面覆铜箔层压板:single-sided copper-clad laminate . T/ i% P" P1 C
6、 双面覆铜箔层压板:double-sided copper-clad laminate
' L2 V) d+ ]* \1 M' t* y7、 复合层压板:composite laminate 5 L/ o1 z% g* |9 \/ F' v
8、 薄层压板:thin laminate 4 I8 ^/ e9 p0 T/ ?
9、 金属芯覆铜箔层压板:metal core copper-clad laminate 0 V* T; v3 I" _
10、 金属基覆铜层压板:metal base copper-clad laminate 8 T( ~! X9 P6 n, _5 E2 K6 P1 ?5 k
11、 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film + `0 R5 a0 i: z: v- p6 h
12、 基体材料:basis material
4 F7 o" A* [" t- k1 v! z5 N# g13、 预浸材料:prepreg K* a2 U) G4 A: g; V7 J" M
14、 粘结片:bonding sheet
`0 z5 {8 e3 z. I' N15、 预浸粘结片:preimpregnated bonding sheer 7 d* y- J* q# O
16、 环氧玻璃基板:epoxy glass substrate
! Z1 a* @: v9 M2 t* S8 J" i, F0 E17、 加成法用层压板:laminate for additive process
1 Z& z- u5 E V( ]18、 预制内层覆箔板:mass lamination panel
7 V6 t; \0 V5 ]' T# p+ P9 X# T19、 内层芯板:core material
& W6 d0 z3 q0 Q6 ?20、 催化板材:catalyzed board ,coated catalyzed laminate
3 Y* o% Y0 c$ [7 e# v21、 涂胶催化层压板:adhesive-coated catalyzed laminate 0 I6 ~/ y/ u/ L) g: _9 n
22、 涂胶无催层压板:adhesive-coated uncatalyzed laminate
) V5 o$ ^& _" x* V5 R) S23、 粘结层:bonding layer d+ p5 b8 E _5 g) ^/ D
24、 粘结膜:film adhesive
! @* o; L; e9 n& g& H25、 涂胶粘剂绝缘薄膜:adhesive coated dielectric film
: E! i- f& k0 a4 p26、 无支撑胶粘剂膜:unsupported adhesive film 2 G- h5 B3 v' f$ n
27、 覆盖层:cover layer (cover lay) , H( k1 X R; K
28、 增强板材:stiffener material
# e! O- ~& k: E; s29、 铜箔面:copper-clad surface
7 I2 \6 M6 g; S3 u30、 去铜箔面:foil removal surface ! A/ g1 Y9 @1 Z4 p
31、 层压板面:unclad laminate surface
/ Z& e- Y+ \- v) z. c3 G32、 基膜面:base film surface
{8 h7 E: I* e q33、 胶粘剂面:adhesive faec 3 I! V( ~! G& H; }, m0 d& O
34、 原始光洁面:plate finish
7 S6 ^6 J$ K8 \# M6 n/ ^+ w+ l35、 粗面:matt finish , d% W; N/ \- n) ~2 F6 T
36、 纵向:length wise direction $ `1 h' `% {* N, o' ~ e* i
37、 模向:cross wise direction
7 o, V6 j# p6 N, N5 j j) I8 U5 H38、 剪切板:cut to size panel + _- B% a: _- _' A0 o8 p% B
39、 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) % x; X- E$ E, b* [* S4 q- k
40、 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
& V" I, U6 h7 T' k4 S' A41、 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 2 F a, S) d" l4 T
42、 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates / L# C0 K0 K0 L+ T
43、 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates
4 M* T- {; I2 c( H8 o8 o$ S44、 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates
t' M) i' J2 Q8 v4 v( H45、 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
I$ d4 ^; N" H2 m3 {46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 2 g& l; A1 r% A0 u. D
47、 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
- i' D' b5 Q0 e+ J5 ]7 W48、 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates
$ C, f7 s& V# I# Q% H+ r49、 超薄型层压板:ultra thin laminate
+ J# K) g6 L# O9 m50、 陶瓷基覆铜箔板:ceramics base copper-clad laminates
2 {4 C* Z% u. F. R( `! e51、 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates
7 G5 q! q1 ~5 u1 q$ ~ TEL 18681567708 详情可见www.sz-jlc.com/s |
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